What is So Special About Wafer Dicing?

The technique of water dicing is used to cut through things, mostly building materials. The machines used for wafer dicing use water based coolant as a stream, which helps the machine to penetrate through the matter. The coolant is first added to the di-ionized water, which reduces the surface tension of the material and then the stream of the liquid cuts with the help of the dicing blade.

The many advantages of the wafer dicing technique are- it prevents the materials from being damaged by reducing the thermal stress, internal cracking, edge damage and so on. This is possible because the dicing blades which helps in accomplishing the work by scribing, breaking and mechanical sawing. The dicing process is accompanied by silicon chips, which are encapsulated within chip carriers. These in turn then help in building various chips for computers and other electronic devices. Various types of materials such as glass, silicon, gallium arsenide, silicon, alumina, ceramics and semiconductors can be diced using this technique. During the process of dicing, wafers are usually mounted on dicing tapes, which have a stick backing that hold the metal plates together. The products of dicing are the dies. These dies are then held and packed within a printed circuit board substrate also known as a bare dye. The area that has been cut off is known as wafer streets, which are approximately seventy-five millimeters or 0.03 of an inch in diameter.

The wafer which has been diced once will remain in the dicing tapes until and unless they are removed using any wafer removing technique such as a die bonder. The technique of usage of silicon wafers that use laser based techniques is known as stealth dicing. The advantage of stealth dicing is that it does not utilize any cooling liquid and there is less debris. Therefore, this technique is always worth a try.

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For more information on wafer dicing, check out the info available online at http://www.kadcoceramics.com/process-capabilities.htm

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